high-density lead-frame array (chip format) (HDA)

High-density lead-framearray ( HDA) is a package form characterized by its high thermal conductivity.

HDA packages have a three-dimensional structure and consist of a single- layer substrate with high heat dissipation. On the underside of the substrate are pads for connecting the package to circuit boards. Other internal pads are used to connect internal components such as resistors, capacitors, FETs and controllers. An inductor is located above the components.

The HDA structure with its external electrical and internal thermal contact surfaces offers good heat dissipation and sufficient scope for the PCB layout.