Phase change materials(PCM) are materials used in construction and heating technology for heat absorption, heat storage and heat dissipation. They are also used in computer technology for heat dissipation and cooling.
As for phase change, the state of phase change material changes from solid to liquid aggregation state at a certain temperature. This change of state is at temperatures between 45 °C and 55 °C, depending on the material composition. The material melts at these temperatures and changes its consistency from solid to soft to liquid.
This effect is exploited for the heat dissipation of high- performance chips and power electronics components. The phase change material, which is present in films, is placed under the component and heated. In the flowing state, it can enter interstices and, after cooling, ensures efficient heat dissipation.