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fan-out wafer level package (FO-WLP)

Fan-outwafer level packaging( FO-WLP) is an interconnect technology in which the fan-outs are connected together as a chip-to-chip connection. This is the case, for example, with superimposed dice of 3D chips.

When assigning the I/Os from the dice to the bumps, the aim is to define the position of the connections in such a way that the connections are as short as possible and thus the package can be constructed in the most space-saving way possible.

As far as fan-outs are concerned, there are usually more of them than fan-ins. FO-WLPs can also be used in memory chips designed as package-on-package( PoP), thereby increasing the compactness of the packages and reducing the overall height. Corresponding chips are used in mobile devices.

Englisch: fan-out wafer level package - FO-WLP
Updated at: 26.08.2020
#Words: 121
Links: level, packaging, fiber optics (FO), chip, connection
Translations: DE

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