Fan-out Panel Level Packaging (FOPLP) is a packaging technology with high miniaturization potential. The technological prerequisites for this are a formed panel in which the chips and other components are embedded.
#0 In FOPLP packaging, the components are wired in thin-film technology on a wiring layer with embedded components. Passive components such as resistors, capacitors and inductors are integrated. Thin-film technology allows the package thickness to be reduced compared to other package technologies. FOPLP packages suitable for SMT technology are characterized by a high number of pins and can be designed as single- chip modules, multi-chip modules and in stacked design.