Due to the ongoing miniaturization and because of the better assembly, there are IC miniature packages that have no connection wires, but can be mounted directly on printed circuit boards via pads
underside of the package.
Dual Flat No-Lead (DFN) is such an IC miniature package for SMT technology
, Quad Flat No-Lead
is another one. Inside thepackage, the chip
isconnected to the pads on the underside of the IC via bonding wires.
Unlike QFN packages, which have the connection pads on all four sides, DFN packages have them on two opposite sides
Dual Flat No-Lead packages are for electronic circuits such as voltage references, voltage transformers or terminating resistors, to name a few. They come in sizes from 2 x 3 mm to 4 x 5 mm with 2 to 20 connection pads. The thickness of the DFN packages ranges from 0.4 mm to 0.9 mm. Compared to a shrink small outline package
(SSOP), a DFN package requires only half the space.