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thin fine-pitch ball grid array (TFBGA)

The TFBGA package (Thin Fine-Pitch Ball Grid Array

) is comparable to the BGA package with the difference that the spherically shaped solder pads on the underside of the package have a smaller distance. This is only 0.5 mm to 1.0 mm.

Structure of a BGA chip

Structure of a BGA chip

The solder pads are arranged in rows and columns as in the BGA package. In addition, the TFBGA packages are only 1.2 mm thick. The difference between TFBGA and VFBGA (Very-Thin Fine-Pitch Ball Grid Array) is the thickness of the package

, which is only 1.0 mm thick in the case of VFBGA. The external dimensions of TFBGA packages (Thin Fine-Pitch Ball Grid Array) are standardized by the Joint Electron Device Engineering Council (JEDEC).

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Englisch: thin fine-pitch ball grid array - TFBGA
Updated at: 26.07.2012
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