The TFBGA package (Thin Fine-Pitch Ball Grid Array
) is comparable to the BGA package with the difference that the spherically shaped solder pads on the underside of the package have a smaller distance. This is only 0.5 mm to 1.0 mm.VFBGA (Very-Thin Fine-Pitch Ball Grid Array) is the thickness of the package
, which is only 1.0 mm thick in the case of VFBGA. The external dimensions of TFBGA packages (Thin Fine-Pitch Ball Grid Array) are standardized by the Joint Electron Device Engineering Council (JEDEC).