The VFBGA package (Very-Thin Fine-Pitch Ball Grid Array) is comparable to the Thin Fine-Pitch Ball Grid Array( TFBGA) with the difference that the spherically shaped solder pads on the package underside have a smaller distance. This is only 0.5 mm to 1.0 mm. As with the BGA package, they are arranged as an array in rows and columns. In addition, the VFBGA packages are only 1.0 mm thin and thus 0.2 mm thinner than the TFBGA packages.
The outer dimensions of the VFBGA packages are standardized by the Joint Electron Device Engineering Council( JEDEC).