Due to increasing miniaturization, several chips are often combined in one package
. Such a combined arrangement is called a multi-chip package (MCP). Logics, interfaces, controllers and memory or other digital units can be combined in an MCP device. The sole aim is to reduce the size of the components. This means that various memories can be integrated in the smallest possible space on MCP components. The multi-chip module (MCM) emerged from the multi-chip package, which resulted in further miniaturization.