micro SMD

The continuous trend towards miniaturization of mobile devices is also reflected in the miniaturization of components, logics and processors. Micro-SMD has significantly reduced the footprint ofpackages.

While the footprint of Thin Shrink Small Outline Packages( TSSOP) was approximately over 10 qmm, it has been reduced to 4 qmm in the various packages such as the SOP package and the SOT package or the SC-70 package. A decisive step in further miniaturization was achieved by Micro-SMD technology.

Micro-SMD is a technology in which the connection contacts are designed as a ball grid array, but the bump size and the spacing of the bumps are much smaller than in BGA packages. For Micro-SMD packages, it is only 0.17 mm, with a pitch distance of 0.5 mm.