thin shrink small outline package (socket, chip) (TSSOP)
The TSSOP package, Thin Shrink Small Outline Package (TSSOP), is a flat dual inline package for SMT technology.
The TSSOP package, which can house digital and analog circuits such as memories, differential amplifiers, A/D converters, DC/DC converters, line drivers, analog buffers, operational ampl ifiers and output amplifiers, can have different numbers of pins: 8, 10, 14, 16, 20, 24, 28, 48, 56, 64 and 80 pins.
Accordingly, the size of a TSSOP package with 16 pins is only 4.4 mm wide, 5 mm long and 0.9 mm thick. The spacing of the pins is 1/4", corresponding to 0.65 mm. For the 40 and 56 pin packages, the pin spacing is reduced to 0.5 mm. The package with 56 pins has a width of 6.1 mm and a length of 14.0 mm, the thickness is 0.9 mm. Compared to the TSSOP package, the Thin Very Small Outline Package( TVSOP) is about 30% to 40% smaller and also flatter. The TSSOP package has been standardized by the Joint Electron Device Engineering Council( JEDEC) under MO-153.