leadless leadframe package (LLP)
In order to be able to build modern communication devices such as cell phones, smartphones and PDAs, MP3 players and flat screens even flatter, the super-flat LLP packages, Leadless Leadframe Package (LLP), developed by National Semiconductor, provide chip packages with a thickness of just 0.4 mm.
The LLP chips have small solder balls on the underside, so-called bumps, via which the chip makes contact with the board. There are various designs with 6 to 80 contact points, with the number being increased to 100 bumps and more in more recent developments, with further reduced overall heights of 0.3 mm and 0.2 mm.