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Inprinted circuit board manufacturing, lamination is the application of a thin film to a substrate or to the base material.

Cold lamination is done with pressure, whereby the cold laminate, which has an adhesive on it, is applied to the base material with pressure. In hot lamination, the foil is passed over heating rollers, where the adhesive liquefies and hardens.

In printed circuit board manufacturing, the copper coating is applied by laminating or laminating a thin copper foil to the uncoated base material.

Englisch: laminate
Updated at: 11.11.2020
#Words: 82
Links: board, application (app), substrate, base material, pressure
Translations: DE

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