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fine land grid array (chip design) (FLGA)

The FLGA package is essentially the same as the BGA package. FLGA packages are available with 48, 56 and 84 connection points.

In the FLGA package, the connection points are not spherical as in the BGA package and FBGA package, but are flat connection contacts.

Structure of the FLGA package

Structure of the FLGA package

As with the FBGA package, the distances between the connection contacts are only 0.80 mm, compared to 1.0 mm or 1.27 mm for Ball Grid Array (BGA). The FLGA package is made of epoxy resin.

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Englisch: fine land grid array (chip design) - FLGA
Updated at: 07.02.2012
#Words: 78
Links: package, ball grid array (chip design) (BGA), connection, indium (In), fine-pitch ball grid array (chip design) (FBGA)
Translations: DE
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