fine-pitch ball grid array (chip design) (FBGA)
The FBGA package (Fine-Pitch Ball Grid Array) is essentially the same as the BGA package (Ball Grid Array). The difference is the pitch of the connection contacts.
FBGA packages are available with 48, 84, 104, 144, 176 and 224 connection points. The connection points are designed as small tin- lead balls. The pitch between the connection contacts is called pitch and is only 0.80 mm for the FBGA package, compared to 1.0 mm or 1.27 mm for the ball grid array (BGA). The chip inside the FBGA package is covered with epoxy resin, and its die contacts are bonded to the balls with thin gold wires.