high density packaging (IC) (HDP)

High Density Packaging (HDP), like ASIC (Application Specific Integrated Circuit), is an integration technology for small or special series. With HDP technology, the unit costs are lower than with ASICs, as are the development costs, and HDP technology is also more suitable for very small series. Applications can be found in specialized fields such as medical, automotive, aerospace, industrial applications and sensors.

HDP technology can be built as a mixed technology with standard components and ASICs.