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ceramic flat package (CFP)

Ceramic Flat Packages(CFP) are available as flat rectangular or square packages. In the rectangular package, the pins are located on the opposite long sides of the package.

The pins can be shaped so that they can be soldered to the PCB using Surface Mounted Technology( SMT). The hermetically sealed ceramic package is suitable for applications where high reliability is required. For example, for space technology, military and special commercial applications with high radiation exposure.

Englisch: ceramic flat package - CFP
Updated at: 01.01.2022
#Words: 75
Links: indium (In), package, protocol control block (TCP) (PCB), surface micromachining technology (SMT), reliability
Translations: DE

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