The word Wirelaid is a combination of Wire and Laid, where Wire stands for wire and Laid for insert. Wirelaid is an embedding technology in which conductor tracks are reinforced by thicker copper inserts or inserted wires. This transforms normal conductive tracks, which can only withstand low currents, into high- current conductive tracks.
The ever-increasing demands placed on power electronics mean that significantly higher currents have to be conducted via the circuit boards and connecting elements. Since normal conductor tracks are extremely thin, they are not suitable for high currents; they would exceed the maximum heating and must be enlarged in conductor cross-section for this purpose. This is done with wires that are embedded in the base material of the circuit boards.
The conductor cross-section and the resistivity of the trace material determine the heating of the trace as a function of the current flow. These relationships are described in IPC Guideline 2152. The correlations show that with normal copper cladding, the traces become very wide and can be 10 mm or more. Since such wide traces are not practical and make the PCBs more expensive, some alternatives are available, such as laying several traces in parallel on the individual layers of a multilayer PCB, thicker copper cladding or wirelaid. Each layer of a multilayer PCB can be used for trace reinforcement. In addition, with wirelaid technology, the trace reinforcement can be provided by a thicker trace or by a round wire.