The wire-wrap technique is a solderless connection technique known as wire-wrap. In the wire-wrap technique, the stripped wire end of a conductor is wrapped around the rectangular contact pin with controlled force using a special tool, the wrap gun.
In a wire-wrap connection, the contact pressure is such that the wire wrap cold-welds to the sharp edges of the contact pin and forms an oxide-free, gas-tight contact.
The wire-wrap connection is described in IEC 60352-1 or DINEN 60352-1 and knows several techniques, which differ in whether the contact pin is wrapped only with stripped wire or partially with insulated wire. The wire-wrap technique is used for electronic assemblies and in backplanes.