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wafer-level chip-scale package (WLCSP)

Wafer-Level Chip-Scale Package (WLCSP) is a micro-SMD technology that has further advanced the miniaturization of chips

and packages. The connection concept of the Wafer-Level Chip-Scale Package (WLCSP) differs from the other BGA packages and CSP packages

inthat no additional underlay material is required. The

actual chip is bonded directly face down onto the PCB using flip-chip technology. This minimizes the inductances between the chip and the PCB. Other advantages include package size reduction, manufacturing time reduction and improved thermal conductivity. Small WLCSP package sizes are 0.65 mm x 0.44 mm and have a thickness of only 0.2 mm.

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Englisch: wafer-level chip-scale package - WLCSP
Updated at: 09.03.2014
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