(TFBGA) with the difference that the spherically shaped solder pads on the underside of the package have a smaller distance. This is only 0.5 mm to 1.0 mm. As with the BGA package, they are arranged as an array in rows and columns. In addition, the VFBGA packages are only 1.0 mm thin and thus 0.2 mm thinner than the TFBGA packages. The external dimensions of the VFBGA packages are standardized by the Joint Electron Device Engineering Council (JEDEC).
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|Englisch:||very-thin fine-pitch ball grid array - VFBGA|