The THR technology (Through Hole Reflow) is a placement technology for printed circuit boards (PCB) with which components for the through hole technology (THT), but also SMD components
, can be processed. With the THR process, in which the through-hole technology is integrated into the SMT technology
, theassembly costs for automatic PCB assembly can be reduced, since some process steps of the THT technology are omitted. However, the prerequisite for integration
isthe validation of
theproduction process as well as
theplacement parameters such as the PCB design and the paste pressure.
In the THR technology, THT components equipped with connection wires are processed using the reflow method. In this process, the connection holes for the connection wires are filled with solder paste. Due to the effect of heat, the solder paste melts during the reflow process and the solder penetrates into the plated-through terminal holes and bonds with the connection wire.