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thin super small leadless package (TSSLP)

Thin Super Small Leadless Packages (TSSLP) differ from Thin Small Leadless Packages (TSLP) in that they are even narrower than the latter. As can be seen from the name, they are extremely thin and have an overall height of far less than one millimeter (0.3 mm).

TSSLP package with 8 contact areas, Photo: Infineon

TSSLP package with 8 contact areas, Photo: Infineon

Depending on the number of contacts, their overall width is only 0.32 mm for two contact areas and only 0.74 mm for eight contact areas, making them only half as wide as comparable TSLPs. The same applies to the overall length, which is 0.62 mm for two contact areas and 1.34 mm for six contact areas. The contact pads are mounted below the package and can be used directly for SMT technology.

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Englisch: thin super small leadless package - TSSLP
Updated at: 05.02.2009
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