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thin small outline package (chip design) (TSOP)

The Thin Small Outline Package (TSOP) is a thinner version of the Shrink Small Outline Package(SSOP) for DRAMs, which is suitable for use in notebooks, laptops and handhelds. It is a rectangular package with a thickness of 1 mm.

Like the Small Outline Package( SOP) and Thin Shrink Small Outline Package (SSOP), the connectors on the TSOP devices are bent outwards for mounting on SMT technology.

28-pin TSOP package

28-pin TSOP package

These devices are available with many different pin counts ranging from 20 to 86 pins. There are also TSOPs with different pin spacings from 0.5 mm over 0.65 mm, 0.8 mm up to 1.27 mm.

TSOP package, photo: OKI

TSOP package, photo: OKI

The TSOP package is available in two versions: in one version, the curved connections are located on the long side of the package, in the other on the cross side. TSOP packages are used in small dual inline memory modules( DIMM) and in credit cards.

Informations:
Englisch: thin small outline package (chip design) - TSOP
Updated at: 14.10.2013
#Words: 147
Links: shrink small outline package (Chip) (SSOP), package, small outline package (chip design) (SOP), surface micromachining technology (SMT), pin
Translations: DE
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