The Thin Small Outline Package (TSOP) is a thinner version of the Shrink Small Outline Package(SSOP) for DRAMs, which is suitable for use in notebooks, laptops and handhelds. It is a rectangular package with a thickness of 1 mm.
These devices are available with many different pin counts ranging from 20 to 86 pins. There are also TSOPs with different pin spacings from 0.5 mm over 0.65 mm, 0.8 mm up to 1.27 mm.
The TSOP package is available in two versions: in one version, the curved connections are located on the long side of the package, in the other on the cross side. TSOP packages are used in small dual inline memory modules( DIMM) and in credit cards.