Thin Film Encapsulation (TFE) is a technology used to protect electronic components such as OLEDs
from external influences, dust, water, air and moisture. In general, the encapsulation of components can be achieved by glass encapsulation. However, such encapsulation is extremely inflexible. The situation is different with thin film encapsulation. As can be seen from the name, thin film encapsulation is a multi-layer encapsulation of the components, which consists of a multi-layer film. Alternating organic and inorganic layers. The inorganic layers are typically made of metal oxides and act as a moisture barrier. Since these layers could become brittle in the long term and allow moisture to pass through, they are protected by an organic film, which also increases flexibility.