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tape automated bonding (package) (TAB)

Tape Automated Bonding (TAB) is a bonding technique in which the chip core, called a dice, is first attached to a flexible plastic before being fabricated into a package.

The actual bonding is done using prefabricated traces located on the polyimide or polyamide plastic material. For this purpose, the chip core is placed on the plastic material and contacted with the conductor tracks, which are equipped with bumps.

The chip is thus on the plastic film and is positioned at the point where it is to be attached to the printed circuit board. After positioning and contacting, the plastic film is trimmed.

Chip of a Tape Automated Bonding (TAB), photo: Westinghouse

Chip of a Tape Automated Bonding (TAB), photo: Westinghouse

TAB technology, whose packages are also known as Tape Carrier Package( TCP), has the advantage that the chips are attached as if on a roll film and can be positioned precisely during production. The plastic widths are 35 mm, 45 mm and 70 mm. The technology is therefore suitable for high production quantities.

Informations:
Englisch: tape automated bonding (package) - TAB
Updated at: 06.12.2013
#Words: 161
Links: bonding, chip, dice, package, polyimide (PI)
Translations: DE
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