structure test

In electronic test environments, structure testing is about verifying manufacturing and assembly processes. A structural test involves testing the wire connections and smaller electronic devices on printed circuit boards, in components, and in equipment.

This can involve visual techniques and optical inspection, as in Automatic Optical Inspection( AOI) or Flying Probe testing, X-ray inspection, as in Automatic X-ray Inspection( AXI), in-circuit testing, or measurements with digital multimeters.

The above tests can be used to detect short circuits, open leads, board breaks, and incorrect or misaligned components. These evaluation criteria have been described by the International Electronics Manufacturing Initiative (iNEMI) in the PCOLA/SOQ methods. The two acronyms stand for Presence (P), Correctness (C ), Orientation (O), Live (L) and Alignment (A), as well as for Shorts (S), Opens (O) and Quality (Q) and cover the entire structural tests.

Structural tests are separate test methods that do not provide information about functionality. This is fulfilled by the functional tests.