small outline integrated circuit (chip design) (SOIC)
The SOIC package (Small Outline Integrated Circuit) is a plastic package for SMT technology in which the bent connection contacts are attached to the long sides.
SOIC packages are specified by the Joint Electron Device Engineering Council( JEDEC) and are available in various standard widths. In addition to the narrow version with a width of 3.8 mm, there is also a version twice as wide with a width of 7.6 mm. The distance between the terminal contacts is 1.27 mm (0.05 inch) as standard.
The pins are angled so that they lie flat on the PCB. The package length depends on the number of connection contacts. SOICs are available in a version with 6, 8, 10, 14 and 16 pins in the width of 3.8 mm and another version with 16, 20, 24 and 28 connections in the width of 7.6 mm.