ITWissen.info - Tech know how online

shrink small outline package (SSOP)

Compared to the Small Outline Package(SOP), the SSOP design (Shrink Small Outline Package) is characterised by a more compact construction with smaller distances between the connections

.

SSOP device with 20 connections, photo: OKI

SSOP device with 20 connections, photo: OKI

SSOP chip devices are available with 8, 16, 20, 28, 30, 32, 48, 56, 64 and 70 connections, with distances of 0.65 mm. The square SSOPs have edge lengths of 5.3 mm (8, 16, 20, 24), 7.6 mm (48, 54) and 10.2 mm (64, 70). Compared to the SSOP package, the Thin Very Small Outline Package (TVSOP) is about 50% to 60% smaller and also flatter. The SSOPs are suitable for SMT technology and are specified by the Joint Electron Device Engineering Council (JEDEC).

Informationen zum Artikel
Englisch: shrink small outline package - SSOP
Updated at: 07.02.2012
#Words: 65
Links: