redistributed chip packaging (RCP)
Redistributed ChipPackage(RCP) is a package technology that uses the classic semiconductor wiring technique for chips via metallization layers. It has a higher integration density than BGA packages and is also more flexible to handle.
RCP packaging provides integration of the semiconductor package as a functional part of the chip and simplifies the assembly process. It is also compatible with modern assembly techniques such as system-in-package( SiP), package-on-package( PoP) and cavity packages. Since chips in RCP technology can be designed more compactly than in other technologies, it offers up to 30% space savings.