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quad flat package (chip design) (QFP)

In the Quad Flat Package (QFP), a square package, the connections are located on all four sides. QFP devices are available with 44, 56, 64, 80, 100, 128, 160, 208, 240, 272 and 304 connections.

QFP module, photo: OKI

QFP module, photo: OKI

The different versions can have a pitch of 0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm and 1.0 mm. Whereby the contacts can be bent downward, outward to the side or under the microprocessor. QFPs are square and have edge lengths of 10 mm (44, 52, 64 connections) and 14 mm (64, 80). QFP packages are used with 16-bit and 32-bit processors, such as the 80286 and 80386.

Informations:
Englisch: quad flat package (chip design) - QFP
Updated at: 24.05.2008
#Words: 82
Links: indium (In), package, pitch,
Translations: DE
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