ITWissen.info - Tech know how online

plasma enhanced chemical vapor deposition (PECVD)

Plasma Enhanced Chemical Vapour De position (PECVD) is a chemical vapour deposition (CVD) process that uses plasma at low temperatures between 250 °C and 350 °C. This process also allows materials with a low melting point, such as aluminum, whose melting point is 500 °C, to be used in printed circuit boards.

Informationen zum Artikel
Englisch: plasma enhanced chemical vapor deposition - PECVD
Updated at: 06.12.2013
#Words: 52
Links:
Translations: DE