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physical vapour deposition (PVD)

The thin-film technology works with the additive process in which individual layers are vapor-deposited onto a substrate. To avoid oxidation and contamination, the coating is applied under high vacuum.

In this process, the materials to be deposited are separated from the gas phase and vapor-deposited onto the substrate at the appropriate locations. The deposition from the vapour phase can be done physically, as in Physical Vapour Deposition (PVD), chemically, as in Chemical Vapour Deposition (CVD), by means of electron or laser beam evaporation or using electrical plasmas.

Material for the PVD process, photo: os-materials.com

Material for the PVD process, photo: os-materials.com

In the PVD process, the solid material is evaporated and condenses on the substrate. The material remains unchanged in its properties. The material can be conductive and semiconductive material from which conductive tracks and semiconductor devices are formed.

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Englisch: physical vapour deposition - PVD
Updated at: 27.03.2009
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