The MCeP package, Molded Core Embedded Package, is a hybrid package consisting of two substrates on top of each other. The upper substrate
contains a copper core and is connected to the lower substrate via solder balls.
are located on the substrate. The lower substrate contains the chip which is attached using fine pitch technique. Thefree space between the lower and upper substrate is filled with casting resin.
The MCeP package has made it possible to reduce the packing density of modern packages. An important aspect of MCeP packages is the warpage of the package, which is in the micrometer range of about 100 µm. The MCeP technology allows the embedding of passive components and ICs.