The MCeP package, Molded Core Embedded Package, is a hybrid package consisting of two substrates on top of each other. The upper substrate contains a copper core and is connected to the lower substrate via solder balls.
There are several stacked chips on the substrate. The lower substrate contains the chip, which is attached using fine- pitch technology. The free space between the lower and upper substrate is filled with casting resin.
The MCeP package has made it possible to reduce the packing density of modern packages. A key aspect of MCeP packages is the warpage of the package, which is in the micrometer range of about 100 µm. MCeP technology allows the embedding of passive components and ICs.