Micro Small-Outline Package (MSOP) is a surface mount small-outline package with 8 or 10 pins
, MSOP8, MSOP10.
MSOP, which is similar in dimensions toThin Shrink Small Outline Package
(TSSOP), has a square package shape with a size of 3 mm x 3 mm (MSOP10) and a thickness of 1.1 mm.The pitch
between the connection contacts is 0.5 mm. In the outline packages, the connection contacts are bent outwards. With the connection contacts, the complete package width is less than 5 mm. MSOP packages accommodate chips as well as converters, couplers and other components.