- Tech know how online

low profile quad flat package (LQFP)

The Low ProfileQuad Flat Package (LQFP) is flatter than the Quad Flat Package (QFP) with a thickness of 1.4 mm. In addition, the spacing of the connectors is only 0.5 mm. LQFP devices are available with 32, 44, 48, 52, 64, 80, 100, 128, 144, 176 and 208 connections.

LQFP package with 32 pins

LQFP package with 32 pins

The LQFP package is specified by JEDEC under various standards. It is designed for SMT technology, has a square structure and has edge lengths of 7.0 mm, 10 mm, 14 mm, 20 mm and 24 mm. The spacing of the pins is between 0.65 mm and 0.5 mm.

Englisch: low profile quad flat package - LQFP
Updated at: 14.08.2008
#Words: 80
Links: quad flat package (chip design) (QFP), indium (In), package, joint electron device engineering council (JEDEC), surface micromachining technology (SMT)
Translations: DE

All rights reserved DATACOM Buchverlag GmbH © 2022