leadless plastic chip carrier (package) (LPCC)
LPCC packages (Leadless Plastic Chip Carrier) are plastic packages that do not have any connection wires, but connection contacts that are located underneath the package. They were developed at the end of the 1990s, can be used for applications with high data rates, and are characterized by good thermal properties and protection against moisture.
LPCC packages have a square structure and are available in sizes between 2 mm and 12 mm with up to 124 connection contacts. Their structure corresponds to the Dual Flat Package ( DFP) and Quad Flat Package( QFP) standardized by the Joint Electron Device Engineering Council ( JEDEC). They can also be built in double-row and in- line versions.
LPCC packages are used for ASICs (Application Specific Integrated Circuit), in digitalsignal processing( DSP) and in Application Specific Standard Product( ASSP). They have a Moisture Sensitivity Level( MSL) of 1 and are optionally available lead-free. Due to the low connection inductances, they can be used in high-speed applications.