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leadless ceramic chip carrier (LCCC)

The LCCC package (Leadless Ceramic Chip Carrier

) belongs to the ceramic chip carrier packages that have no connection wires.

Overview of chip carrier

Overview of chip carrier

packages LCCC packages are rectangular or square packages in which the connection contacts are led outwards as contact surfaces on all four sides. The base material is ceramic. LCCC packages are available in sizes between 5 qmm and 25 qmm and above. The contact spacing, the pitch, is 1.27 mm or 0.05 inch; the number of contacts can be between 20 and 100. The structure of the LCCC packages is characterized by the fact that the dice is bonded to a ceramic plate and the bonds lead to the outwardly guided metallic connection surfaces (pads).

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Englisch: leadless ceramic chip carrier - LCCC
Updated at: 26.07.2012
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