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leadframe chip scale package (LFCSP)

The LFCSP package evolved from the CSP package and is characterized by the fact that there are no connections

outside the chip size.

Bottom view of an LFCSP package with 16 connections, graphic: Analog Devices

Bottom view of an LFCSP package with 16 connections, graphic: Analog Devices

The spacing of the connection contacts, the fine pitch

, can be 0.5 mm or 0.8 mm, the number of connections is between 8 and 64, the staggering is: 8, 10, 12, 16, 24, 28, 32, 40, 48, 56 and 64. Since the LFCSP packages can have two different contact spacings, there are different LFCSP packages in several sizes. The sizes of the very compact packages range from 2 mm x 2 mm (8 connections) to 3 mm x 3mm (10, 12, 16), 4 mm x 4 mm (16, 20, 24) up to 9 mm x 9 mm for an LFCSP package with 64 connections.

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Englisch: leadframe chip scale package - LFCSP
Updated at: 26.07.2012
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