leadframe chip scale package (LFCSP)
The LFCSP package has evolved from the CSP package and is characterized by the fact that there are no connections outside the chip size.
The spacing of the connection contacts, the fine pitch, can be 0.5 mm or 0.8 mm, the number of connections is between 8 and 64, the staggering is: 8, 10, 12, 16, 24, 28, 32, 40, 48, 56 and 64.
Since the LFCSP packages can have two different contact pitches, there are different LFCSP packages in several sizes. The sizes of the very compact packages range from 2 mm x 2 mm (8 connections) to 3 mm x 3mm (10, 12, 16), 4 mm x 4 mm (16, 20, 24) and up to 9 mm x 9 mm for an LFCSP package with 64 connections.