Laser Direct Imaging (LDI) is an alternative technique to the classic exposure of printed circuit boards via film masks. With the LTI technique, printed circuit boards and solder masks are exposed directly, without an intermediate step.
Direct laser image exposure has the advantage of working at a high resolution. As a result, conductor paths can be exposed in ultra-fine and micro-fine conductor technology. In other words, conductor structures with widths of 20 µm. In addition, there are no offset problems because the PCB layout is scalable and can thus be exposed to match the base material.
In laser image exposure, the conductor track structures are burned directly into the film sequentially via a digitally controllable laser. The laser beam is controlled by controllable optical lens systems. The wavelength of the laser beam is a criterion for the optical resolution.