fine land grid array (chip design) (FLGA)
The FLGA package is essentially the same as the BGA package. FLGA packages are available with 48, 56 and 84 connection points.
In the FLGA package, the connection points are not spherical as in the BGA package and FBGA package, but are flat connection contacts.
As with the FBGA package, the distances between the connection contacts are only 0.80 mm, compared to 1.0 mm or 1.27 mm for Ball Grid Array (BGA). The FLGA package is made of epoxy resin.