In PCB manufacturing, lamination is the application of a thin film to a substrate or base material
. Cold lamination is performed with pressure, whereby the cold laminate on which there is an adhesive is applied to the base material with pressure. In hot lamination, the foil is passed over heating rollers, where the adhesive liquefies and hardens.
In printed circuit board manufacturing, the copper coating is applied by laminating or laminating a thin copper foil to the uncoated base material.