High Temperature Cofired Ceramics (HTCC) are ceramic foils used as circuit carriers in printed circuit board manufacturing.
The HTCC foils are soft before sintering and are sintered between 1,600 °C and 1,800 °C. In contrast, Low Temperature Cofired Ceramics
(LTCC) are sintered between 850 °C and 900 °C. Theconductive tracks of HTCC technology have a higher resistance
than those of LTCC technology. HTCC technology is used in multilayer printed circuit boards, where the multilayer layers consist of aluminum oxide, tungsten and molybdenum. The technology is characterized by a high intergration density and can consist of up to 70 conductor path layers.