High DensityPackaging (HDP) is, like ASIC (Application Specific Integrated Circuit), an integration technology for small or special series. With HDP technology, the unit costs are lower than with ASICs, as are the development costs, and HDP technology is also more suitable for very small series. The areas of application are found in special fields such as medical technology, automotive and aerospace technology, industrial applications and sensors
. HDP technology can be structured as a mixed technology with standard components and ASICs.