High-density lead-frame array (HDA) is a package form that is characterized by its high thermal conductivity
. HDA packages have a three-dimensional structure and consist of a single-layer substrate with high heat dissipation. On the underside of the substrate are pads for connecting the package to circuit boards. Other internal pads are used to connect internal components such as resistors, capacitors, FETs and controllers
. The HDA structure with its external electrical and internal thermal contact surfaces offers good heat dissipation and sufficientleeway
for the PCB layout.