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high density interconnect (PCB) (HDI)

The increasing miniaturization of devices, assemblies and components is placing more and more demands on the component and trace density of printed circuit boards. The design solutions are achieved by reducing the pad diameters, reducing the trace width and spacing, increasing the number of layers and microvias for the contacts. All these design features characterize HDI (High Density Interconnect) PCBs, a multilayer PCB that are between 0.8 mm and 2.4 mm thin, depending on the number of layers.

The conductor path structures of HDI

Englisch: high density interconnect (PCB) - HDI
Updated at: 13.11.2013
#Words: 81
Links: trace, density, pad, protocol control block (TCP) (PCB),
Translations: DE

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