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flip chip ball grid array (FCBGA)

Flip ChipBall Grid Array (FCBGA) is an interconnect technique used to connect the die

chip to the contact points.

FCBGA package (from bottom), Photo: Intel

FCBGA package (from bottom), Photo: Intel

Compared to bonding, flip chip technology has the advantage that there are no bonding wires and thus higher clock frequencies can be achieved. The die chip lies with its surface on the substrate. Micro-FCBGA technology was developed with the Celeron for mobile devices, which is based on Coppermine. With BGA technology, the packages can be soldered directly onto the motherboard.

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Englisch: flip chip ball grid array - FCBGA
Updated at: 13.04.2012
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