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fan-in wafer level package (FI-WLP)

Fan-In Wafer Level Packaging (FI-WLP) is an interconnect technology in which the fan-ins of the chips are directly interconnected at chip level. A typical example is the superimposed dice of3D chips

. When assigning I/Os from the dice to the bumps

, the aim isto determine the position of the connections in such a way that the connections

are as short as possible and thus thepackage

can be constructed in the most space-saving way possible. As far as the fan-ins are concerned, they usually have fewer connections than fan-outs.

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Englisch: fan-in wafer level package - FI-WLP
Updated at: 26.08.2020
#Words: 80
Translations: DE