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fan-in wafer level package (FI-WLP)

Fan-InWafer Level Packaging (FI-WLP) is an interconnect technology in which the fan-ins of the chips are connected directly at chip level. A typical example is the superimposed dice of 3D chips.

When assigning the I/Os from the dice to the bumps, the aim is to define the position of the connections in such a way that the connections are as short as possible and thus the package can be constructed in the most space-saving way possible.

As for the fan-ins, they usually have fewer connections than fan-outs.

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Englisch: fan-in wafer level package - FI-WLP
Updated at: 26.08.2020
#Words: 87
Links: chip, level, dice, package, space (SP)
Translations: DE
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